SanDisk Storage Malaysia Sdn Bhd Hiring!!

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    SanDisk Storage Malaysia Sdn Bhd Hiring!!

    About SanDisk

    SanDisk Corporation (NASDAQ: SNDK) is a global leader in flash memory storage solutions, from research and development, product design and manufacturing to branding and distribution for OEM and retail channels. Since 1988, SanDisk’s innovations in flash memory and storage system technologies have provided customers with new and transformational digital experiences. SanDisk’s diverse product portfolio includes flash memory cards and embedded solutions used in smart phones, tablets, digital cameras, camcorders, digital media players and other consumer electronic devices, as well as USB flash drives and solid-state drives (SSD) for the computing market. SanDisk’s products are used by consumers and enterprise customers around the world.

    For our business expansion in Malaysia, we are looking forward to you joining us. Please check out our current openings and connect with us today.

     

    Sr. Director Operation Management – 1 position

    Requirements:

    • Bachelor or Master Degree in engineering or management background, familiar with the process of semiconductor manufacturing factory or electronics component manufacturing.
    • Minimum 10 years of solid operations management in Semiconductor/ Electronic Component multinational company with at least 6 years’ experience at management level
    • Strong hands-on experience in IC Manufacturing; knowledge in SMT Manufacturing and SSD will be an advantage. And strong interaction skills.

    Responsibilities:

    • Direct management of manufacturing (production, engineering, planning, capacity management, facilities, logistics, quality assurance, failure analysis & reliability functions head.
    • Indirect management of support group (Human Resource, Security, Procurement, Finance, IT, R&D) functions head.
    • Have overall responsibilities to ensure flawless execution of the factory operation and related supporting supply chain.
    • Initiate and implement key initiatives like Lean Six Sigma, TPM, closed-loop quality control, statistical process control, etc. to meet or exceed KPIs and drive competitive advantage.

     

    Sr. Manager Manufacturing Management – 1 position

    Requirements:

    • Excellent written and verbal communication skills in English and BahasaMalaysia
    • Demonstrated prior success in a leading role in a manufacturing environment within a large organization
    • Must show adaptability to manage effectively in a fast-paced, high-volume Semiconductor Manufacturing
    • Must have the ability to drive results and maintain personal accountability for manufacturing efficiencies
    • Ability to recruit, build, develop, and foster talent by creating a productive, growth oriented and continuous learning environment

    Responsibilities:

    • Provide overall direction for strategy development, planning and execution of required manufacturing activities in support of SDSM Corporate objectives
    • Provide direction to develop a rigorous manufacturing infrastructure
    • Develop and execute processes and process improvement initiatives to ensure all manufacturing objectives are achieved

     

    Manager ll, QA/QC Engineering Management – 1 position

    Requirements:

    • BS/BA/BEng/MEng degree or equivalent with 8 or more years of related experience and 2 or more years of direct management experience.
    • The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment.
    • Strong management skills including effective time management, communications, problem resolution, decision making, presentation, human relations, organization, and delegation.
    • Managing multiple projects simultaneously.

    Responsibilities:

    • Develops, implements, and maintains technical quality assurance and control systems and activities
    • Defines and specifies the implementation of standards, methods, and procedures for inspecting, testing, and evaluating the precision, accuracy, process and product stability via SPC, and reliability of company products.
    • Participates in the reviewing of engineering designs, production process, supplier process to contribute quality requirements and considerations

     

    Manager ll, Production Engineering Management – 1 position

    Requirements:

    • Bachelor’s degree in Electrical or Electronics Engineering or relevant courses. Master’s or PhD preferred.
    • >=6 years’ experience in semiconductor testing and/or product engineering,
    • Knowledgeable on multiple test platforms such as Advantest Memory Testers, commercially available system testers and Memory Burn-In oven operations.
    • Good knowledge on CMOS and Electronic circuits. Particularly Flash Memories (NAND or NOR) and DRAM/ SRAM and Logic Devices.

     Responsibilities:

    • Responsible for leading his/her team in start-up and product transfers into the factory while achieving and sustaining High Volume Manufacturing Yield, Test Time and DPPM goals.
    • Ensures standard and compliance for test program buy-offs and product qualification related to test.
    • Ensures team capability to deliver Failure Analysis of product yield improvement to meet yield and QUALITY targets.

     

    Manager l, Process Engineering Management – 1 position

    Requirements:

    • Master degree in Mechanical/Material/Electrical/Physics Engineering
    • 8+ years of process engineering experience in semiconductor assembly and test manufacturing plant.
    • Experience to manage team >10 engineers.
    • Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D,5-why,TOC etc.).

    Responsibilities:

    • Leading and managing the PE team to achieve the department objective and goal;
    • PE: Support production, problem solving, and work flow and instruction preparation;
    • IE: Set up and monitor standard cycle time, production efficiency analysis, cost reduction and continuing improvement programs;
    • Lead the process analysis and PFMEA for new product, suggest product design improvement, and ensure new product manufacturability;
    • Initiate the line layout/ balance optimization, improve the production line efficiency;

     

    Sr. Quality Engineer – 1 position

    Requirements:

    • Require Bachelor degree and above in Electronics Engineering, Microelectronics, Mechanical, Statistical, Material or related major.
    • Require to have statistical analysis knowledge and quality tooling, e.g. SPC, JMP, FMEA, Control Plan, 8D, 5-Why, 5M+1E etc.
    • Required to have NAND or Controller test / assembly process/program/equipment knowledge

    Responsibilities:

    • Develops, implements, and maintains technical quality assurance and close loop control systems and activities of test / assembly equipment, test / assembly program, test / assembly process, yield and limit setting and material with data and statistical
    • Develop, implement and maintain statistical system to monitor and enable the capability of providing early detection and prevent / minimize impact or excursion.
    • Evaluate & conduct risk assessment of quality and reliability of company products, assist on low yield analysis and provide recommendation/disposition of MRB material

     

    Sr. Manufacturing Equipment Engineer (BOP) – 1 position

    Requirements:

    • Bachelor/Master degree in Industrial Engineering or Mechanical Engineering  or Electrical engineering
    • At least 5 years of experience on engineering for equipment maintenance/repair/improve in Semiconductor Assembly and Test Industry
    • Experience on all of Assembly EOL equipment including Marking, Solder ball attach, Laser cut, Singulation etc.

    Responsibilities:

    • Lead to build new production line, include: generate MC PO specification; setup, CIP and buyoff activities.
    • Lead maintenance team to meet the goals on Machine Down time; Utilization and to improve MTBA/MTBF
    • Daily trouble shooting equipment to support production (Marking, Solder ball attach, Laser cut, Singulation etc) and can handle machine conversion/setup independently.

     

    Sr. Manufacturing Equipment Engineer ( FOP) – 1 position

    Requirements:

    • Bachelor/Master degree in Industrial Engineering or Mechanical Engineering  or Electrical engineering
    • At least 5 years of experience on engineering for equipment maintenance/repair/improve in Semiconductor Assembly and Test Industry
    • Experience on all of Assembly FOL equipment including SMT, back grinding, die attach, wire bond, molding, etc.

    Responsibilities:

    • Lead to build new production line, include: generate MC PO specification; setup, CIP and buyoff activities.
    • Lead maintenance team to meet the goals on Machine Down time; Utilization and to improve MTBA/MTBF
    • Daily trouble shooting equipment to support production (SMT, back grinding, die attach, wire bond, molding, etc.).
    • Can handle machine conversion/setup independently and PM, overhaul.

     

    Sr. Manufacturing Equipment Engineer ( Card Assembly) – 1 position

    Requirement:

    • Bachelor/Master degree in Industrial Engineering or Mechanical Engineering  or Electrical engineering
    • At least 5 years of experience on engineering for equipment maintenance/repair/improve in Semiconductor Assembly and Test Industry
    • Experience on all of Assembly CA equipment including welding, laser mark, ink mark, color print, auto optical inspection, packing, etc.

    Responsibilities:

    • Lead to build new production line, include: generate MC PO specification; setup, CIP and buyoff activities.
    • Lead maintenance team to meet the goals on Machine Down time; Utilization and to improve MTBA/MTBF
    • Daily trouble shooting equipment to support production (welding, laser mark, ink mark, color print, auto optical inspection, packing, etc.).
    • Can handle machine conversion/setup independently and handle machine PM and overhaul.

     

    Sr. Manufacturing Equipment Engineer ( TOP) – 1 position

    Requirements:

    • University Graduate and major in the electromechanical
    • At least 5 years working experience in related machine troubleshooting, memory tester and BI  experience in Advantest/JEC/techWing is preferred.
    • Familiar with Unix/Linux system.
    • Technical Expert capacity extension for test Equipment and process.

    Responsibilites:

    • Work out Equipment work instruction
    • New equipment set-up & buy-off per product and process requirement.
    • Support equipment continuous improvement on OEE, MTBA, MTBF, Yield, and Quality.
    • To support production equipment Line Maintenance and Preventive Maintenance.
    • Overall manage machine maintenance activity.

     

    Sr. Product Engineer ( Burn – In)  – 1 position

    Requirements:

    • Bachelor’s degree in Electrical or Electronics Engineering or relevant courses. Master’s or PhD preferred.
    • >=2 years’ experience in semiconductor testing and/or product engineering.
    • Demonstration of expertise on commercially available Burn-In/memory testers such as JEC and Advantest.  Knowledge on other Automated Test Equipment (ATE) platforms will be a plus.
    • Good knowledge on CMOS and Electronic circuits. Particularly Flash Memories (NAND or NOR). Knowledge on DRAM/SRAM and Logic/embedded devices will be a plus.

    Responsibilities:

    • Responsible for test program buy-offs and product qualification related to test.
    • Responsible for Failure Analysis of product yield improvement to meet yield and QUALITY targets.
    • Responsible to drive Customer Satisfaction
    • Meet internal and external customer requirements

     

    Sr. Product Engineer ( MT) – 1 position

    Requirements:

    • Bachelor’s degree in Electrical or Electronics Engineering or relevant courses. Master’s or PhD preferred.
    • >=2 years’ experience in semiconductor testing and/or product engineering.
    • Demonstration of expertise on commercially available memory testers such as Advantest and Magnum. Other Automated Test Equipment (ATE) platforms will be a plus.
    • Good knowledge on CMOS and Electronic circuits. Particularly Flash Memories (NAND or NOR). Knowledge on DRAM/SRAM and Logic/embedded devices will be a plus.

    Responsibilities:

    • Responsible for test program buy-offs and product qualification related to test.
    • Responsible for Failure Analysis of product yield improvement to meet yield and QUALITY targets.
    • Responsible to drive Customer Satisfaction
    • Meet internal and external customer requirements

     

    Sr. Product Engineer ( System Test) – 1 position

    Requirements:

    • Bachelor’s degree in Electrical or Electronics Engineering or relevant courses. Master’s or PhD preferred.
    • >=2 years’ experience in semiconductor testing and/or product engineering.
    • Demonstration of expertise on commercially available memory system testers such as Advantest or familiar with system level testing in memory devices (home-grown or commercially available) will be a plus.
    • Good knowledge on CMOS and Electronic circuits. Particularly Flash Memories (NAND or NOR). Knowledge on DRAM/SRAM and Logic/embedded devices will be a plus.

    Responsibilities:

    • Responsible for test program buy-offs and product qualification related to test.
    • Responsible for Failure Analysis of product yield improvement to meet yield and QUALITY targets.
    • Responsible to drive Customer Satisfaction
    • Meet internal and external customer requirements

     

    Sr. Reliability Engineer – 1 position

    Requirements:

    • BS/BA degree or equivalent with 5 or more years of related experience.
    • The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment.
    • Self-motivated and self-directed, however, must have demonstrated ability to work well with people.
    • Work as a team member, both on the same team and outside of the team and ability to communicate good English.

     Responsibilities:

    • Evaluates the electrical and mechanical characteristics of systems and/or integrated circuits, components, sub-components and systems to determine the cause of failure, including the verification of analog and digital performance.
    • Analyzes failure reports and recommends corrective action.
    • Develops methods, processes, procedures and equipment that will improve the failure analysis process and/or reduce failures
    • Evaluates, from a reliability standpoint, the materials, properties and techniques used in production. Advises design engineering on selection, application and test of electronic components and systems.

     

    Sr. Process Engineer ( BOP)– 1 position

    Requirements:

    • Bachelor degree or above in Mechanical/Material/Electrical/Physics Engineering
    • 5+ years of process engineering experience in semiconductor assembly and test manufacturing plant.
    • Must have experience and knowledge on backend stations including Laser cut (EO and Hanmi)/Laser mark (EO)/Saw singulation (Hanmi)/Solder ball attach (Au800), etc.
    • Must have capability to setup MC recipe, and excellent skill for MC parts, software principle.

    Responsibilities:

    • Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
    • Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
    • Responsible for new material/component first articles inspection and final buyoff.
    • Continuous improvement on direct/indirect material cost down & yield enhancement program.
    • Ensure robustness of process control to meet yield & thru-put expectation.

     

    Sr. Process Engineer ( COP)– 1 position

    Requirements:

    • Bachelor degree or above in Mechanical/Material/Electrical/Physics Engineering
    • 5+ years of process engineering experience in semiconductor assembly and test manufacturing plant.
    • Must have experience and knowledge on backend stations including ink marking (cogitate CF-K8250), laser marking (EO), welding(Genesem AUA2000), AOI/T&R(STI/ICOS), Packing etc.
    • Knowledge for molding insertion materials(PC/PE/ABS)
    • Experience for the lid, tray design with autoCAD & solid works.
    • Well known the qualification process for the lid/tray/T&R/packing material. etc.

     Responsibilities:

    • Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
    • Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
    • Responsible for SD label/lid & packing material (tray, T&R, box.etc) design and qualification.
    • Continuous improvement on direct/indirect material cost down & yield enhancement program.
    • Ensure robustness of process control to meet yield & thru-put expectation.

     

    Sr. Process Engineer ( Die Attach)  – 1 position

    Requirements:

    • Bachelor degree or above in Mechanical/Material/Electrical/Physics Engineering
    • 5+ years of process engineering experience in semiconductor assembly and test manufacturing plant.
    • Must have experience and knowledge at Substrate Baking, Plasma cleaning, Normal Cure, High Pressure Cure & Die attach (Hitachi Bonder-DB800)
    • Experience on high die stack up to 8-16Dies
    • Hands on skill with machine / DA tool setup & PM will be preferred
    • Base understanding on Die pick-up & place mechanism/concept:3-step ejection.

    Responsibilities:

    • Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
    • Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
    • Responsible for new material/component first articles inspection and final buyoff.
    • Continuous improvement on direct/indirect material cost down & yield enhancement program.
    • Ensure robustness of process control to meet yield & thru-put expectation.

     

    Sr. Process Engineer ( DP ) – 1 position

    Requirements:

    • Bachelor degree or above in Mechanical/Material/Electrical/Physics Engineering
    • 5+ years of process engineering experience in semiconductor assembly and test manufacturing plant.
    • Must have experience and knowledge at DP (BG: DAG/DBG; Wafer Saw: Blade Saw/Laser Saw; Taping/De-taping).
    • Must be familiar with machine: set up recipe and optimize process parameters to improve process (Especially for BG & Wafer Saw process)
    • Materials expertise: Die Attach film, BG tap, Saw Blade, Grinding Wheel etc.

    Responsibilities:

    • Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
    • Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
    • Responsible for new material/component first articles inspection and final buyoff.
    • Continuous improvement on direct/indirect material cost down & yield enhancement program.

     

    Sr. Process Engineer ( Molding ) – 1 position

    Requirement:

    • Bachelor degree or above in Mechanical/Material/Electrical/Physics Engineering
    • 5+ years of process engineering experience in semiconductor assembly and test manufacturing plant.
    • Must have experience and knowledge at Molding process (TOWA PMC/YPS) & Compound critical properties (Kyocera /Sumitomo/Hitachi), control.
    • Develop new recipe with fully process Chz & failures root-cause analysis n improvement,
    • Proficient in standard business application software, Tools & standard engineering method (JMP Word, Excel, PowerPoint, AutoCAD, SPC, DOE, DMAIC, 8D,5-why, 5M+1E, FMEA,etc.).

    Responsibilities:

    • Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
    • Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
    • Responsible for new material/component first articles inspection and final buyoff.
    • Continuous improvement on direct/indirect material cost down & yield enhancement program.

     

    Sr. Process Engineer ( WB ) – 1 position

    Requirements:

    • Bachelor degree or above in Mechanical/Material/Electrical/Physics Engineering
    • 5+ years of process engineering experience in semiconductor assembly and test manufacturing plant.
    • Must have experience and knowledge at Wire Bonding Gold/Ag-Alloy-wire bonding (K&N, ultra/Iccon)
    • Develop wire bond program & optimization such as thin overhang die, long wire length with ultra-low-loop.
    • Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D,5-why, 5M+1E etc.).

    Responsibilites:

    • Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
    • Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
    • Responsible for new material/component first articles inspection and final buyoff.
    • Continuous improvement on direct/indirect material cost down & yield enhancement program.

     

    Supervisor l, Manufacturing Management ( FOP) – 1 position

    Requirements:

    • Bachelor degree or above
    • With 4years or above related work experience in ASSY SMT/DP/DA/WB/MOLD in semiconductor Company.
    • Strong responsible and adapt for pressure; Hard-working;
    • Good Communication with Sup./Leader /Op/PE/EE/Etc, could deal with different case and get agreement for Win-Win;

    Responsibilities:

    • Be responsible for Cycle time/WIP Days/Output/Shipment/Quality/ Productivity and more objective to meet goals,
    • Follow-up of the production plan in order to satisfy internal customer needs.
    • Raise the productivity rate, reducing waste of resources, and improve 6S.
    • Organize action plan to reach the targets of the company / department
    • Coordinate quality and productivity improvement in the production area

     

    Manager l, Manufacturing Management – 1 position

    Requirements:

    • Bachelor degree or above
    • Requires 8years and above in Assy&Test manufacture experience and 3years above in direct  Assy&Test manufacture management experience
    • Good Spoken and Written English, work with Excel/PPT Excellent;
    • The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment.
    • Strong management skills including effective time management, communications, problem resolution, decision making, presentation, human relations, organization, and delegation.
    • Managing multiple projects simultaneously.

    Responsibilities:

    • Directs the development and implementation of activities in production area(s) to meet production goals, quality, and cost objectives.
    • Prioritizes production schedules based on product introduction, equipment efficiency, and materials supply. Plans and administers procedures and budgets.
    • Makes budgetary recommendations regarding and, at higher levels, controls capital expenditures and direct/indirect labor.

     

    Sr. Manager Ops and Planning – 1 position

    Requirements:

    • Position requires a BS/BA degree.
    • This position requires a minimum of 10 years of experience in Production/Supply Chain Planning with at least 5 yrs of directly supervising/managing a planning group.
    • The ideal candidate will have experience working with an industry recognized ERP system such as SAP or Oracle as well as an advanced planning system such as i2.

    Responsibilities:

    • Take the build plan fromAsiaplanning and work out the daily production loading plan by process with considering the machine utilization, demand priority and silicon and other material availability in order to meet the demand on time.
    • Driving the daily production status review meeting to monitor the production status, identify the gaps and drive for timely resolution of issues and implement process changes as required.
    • Hold daily OPS call withUSsupply chain planning as well as product managers to share / exchange information needed; use the OPS call as escalation & expediting channel.

     

    Manager ll, NPI Engineering – 1 position

    Requirements:

    • Bachelor degree with Engineering related majors.
    • Minimum of 5 years’ experience in NPI project management leadership position in IC assembly & test field.
    • Be familiar with memory product (Flash is preferred)
    • Good knowledge on semiconductor assembly and test processes.
    • Experience with PLC, NPI or other new product development processes
    • Proven track record with New Product Development and release

    Responsibilities:

    • Direct and lead the NPM team with full ownership on program management for all new product development and release, including specific departmental responsibilities listed below.
    • Drive the NPM team and product line core team through the SanDisk PLC process for all NPI programs, guiding the team through the deliverables for each phase gate exit from product/process characterization and development to production ramp up, including:
    • Prepare and manage assigned sections of project schedule
    • Lead all NPI builds and commit the schedule to SDUS counter partners.
    • Develop ramp up plan for new products and conduct manufacturing readiness reviews

     

    Sr. Production Planner – 1 position

    Requirements:

    • Position requires a bachelor degree with 5 yrs exp in direct experiences. Solid experience of SAP.
    • I2/SCP and MES (Manufacturing Execution System) is preferred.
    • Fluent communication in English, both writing and speaking.
    • Work under pressure

    Responsibilities:

    • Be responsible for developing and implementing the company’s production control functions including any of the following activities, master scheduling, production planning /coordination, shop scheduling and dispatching, planning systems, work-in-process tracking, and manufacturing performance reporting.
    • Maintains reports to reflect scheduling, methods, support performance and process procedures.
    • Select, develop, and evaluate personnel to ensure the efficient operation of the function
    • Products planning to order fulfillment, production planning base on demand and backlog check, commitments to orders.

     

    Sandisk Storage Malaysia Sdn Bhd,
    Plot 18, Lorong Jelawat 4, Kawasan Perindustrian,
    Seberang Jaya, 13700 Perai, Penang
    Tel: 04- 3880212 / +86
    Contact Person: Ms. Kavita / Ms.Izzie Lu

    E- mail –  staffing.sdsm@sandisk.com